{"id":2210,"date":"2022-11-14T21:47:40","date_gmt":"2022-11-14T20:47:40","guid":{"rendered":"https:\/\/protecno.fr\/?post_type=cpt_innovations&p=2210"},"modified":"2022-11-14T21:47:44","modified_gmt":"2022-11-14T20:47:44","slug":"midimu","status":"publish","type":"cpt_innovations","link":"https:\/\/protecno.fr\/en\/our-innovations\/midimu\/","title":{"rendered":"Midimu"},"content":{"rendered":"\n

Full project name<\/strong>: Mixed Microwave and Digital Multilayer PCB for High Density Applications<\/p>\n\n\n\n

Project acronym: <\/strong>MIDIMU-HD<\/p>\n\n\n\n

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The MIDIMU-HD project aims to develop a new technology enabling the design and manufacture of high density mixed microwave circuits and digital printed circuit boards from multilayer dielectric material Key innovations include integrated filters and other microwave features coupled with stacked microvias and HDI technologies. This new approach allows a significant improvement in the long-term reliability of printed circuit boards, which is a strong demand from end-users in professional electronics. The project offers the opportunity to develop a highly integrated transceiver module operating in the target bandwidth of 40.5 to 43.5 GHz, enabling a major breakthrough for:<\/p>\n\n\n\n