{"id":2212,"date":"2022-11-14T21:53:00","date_gmt":"2022-11-14T20:53:00","guid":{"rendered":"https:\/\/protecno.fr\/?post_type=cpt_innovations&p=2212"},"modified":"2022-11-14T21:53:04","modified_gmt":"2022-11-14T20:53:04","slug":"corsaire","status":"publish","type":"cpt_innovations","link":"https:\/\/protecno.fr\/en\/our-innovations\/corsaire\/","title":{"rendered":"Corsaire"},"content":{"rendered":"\n

Full project name:<\/strong> Innovative multi-layer technology for microwave applications<\/p>\n\n\n\n

Project acronym:<\/strong> CORSAIRE<\/p>\n\n\n\n

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This project consists in considering a three-dimensional integration of passive components inside and outside the printed circuit. The challenge of the Corsaire project is therefore to develop a multilayer microwave printed circuit technology based on high integration density with improved quality. This involves reviewing design methods from a global perspective: from components to systems, including subsystems and packaging.<\/p>\n\n\n\n

This example proposes the presence of cavities, air cavities with dielectric resonators in the internal layers of the substrate and multilayer planar circuits on the outer surface of the PCB in order to optimise performance and miniaturisation.<\/p>\n\n\n\n

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Proposed multi-layer technology from the Corsaire project<\/figcaption><\/figure><\/div>\n\n\n\n


Advantages of the Corsaire project with the integration of RF functions:<\/h2>\n\n\n\n