{"id":1875,"date":"2022-11-14T15:35:48","date_gmt":"2022-11-14T14:35:48","guid":{"rendered":"https:\/\/protecno.fr\/?post_type=cpt_technos&p=1875"},"modified":"2022-11-14T15:35:52","modified_gmt":"2022-11-14T14:35:52","slug":"hdi-sbu","status":"publish","type":"cpt_technos","link":"https:\/\/protecno.fr\/en\/our-technologies\/hdi-sbu\/","title":{"rendered":"HDI-SBU"},"content":{"rendered":"\n

HDI<\/h2>\n\n\n\n

What is a HDI?<\/h3>\n\n\n\n

UAn HDI PCB is defined by its high density of interconnections. HDI PCBs have thin traces and isolations, vias and microvias.<\/p>\n\n\n\n

What is a buried hole?<\/h3>\n\n\n\n

A buried hole is a hole between several internal layers. Buried holes are usually drilled mechanically. (see HDI diagram)<\/p>\n\n\n\n

What is a blind hole?<\/h3>\n\n\n\n

A blind hole only goes through part of the PCB, it is a non-through hole. The blind hole is made by mechanical or laser drilling. (see HDI diagram)<\/p>\n\n\n\n

What is a microvia?<\/h3>\n\n\n\n

LeMicrovias are blind holes drilled with lasers. In most cases, a microvia is a blind hole with a diameter of 150\u00b5m or less and a height no greater than its width. The metal plating ratio of the microvia is usually 0.8 to 1.<\/p>\n\n\n\n

\"\"<\/figure><\/div>\n\n\n\n

SBU Definition<\/h3>\n\n\n\n

Sequential Build Up (SBU) technology is a technology used to create HDI circuits. This technology combines several successive layers in a sequence of holes. It uses buried, blind and microvias technologies to densify the interconnections.<\/p>\n\n\n\n

Types of HDI features<\/h3>\n\n\n\n

Case I<\/strong>
It includes:<\/p>\n\n\n\n