Telecommunication and consumer products drive more and more electronic system technology. New component packaging, printed board manufacturing processes and PCB technology are more and more developed for a high integration level in relationship with handheld electronics.

This project is in this continuum by proposing to develop a new technology making possible the design and manufacture of a high density mixed microwave and digital board, on a multilayer homogeneous material. Indeed, systems including microwaves and digital functions, like transmit-receive (T/R) modules, are designed with at least two different electronic boards or are based on a heterogeneous substrate material. This new approach must permit also to significantly improve the long term reliability of the board which is a strong demand of end user in professional electronics Indeed, boards based on heterogeneous substrate material do not or hardly offer a high reliability level. In particular for long term mission profiles under harsh environmental conditions with extended temperature ranges, vibrations or shocks. Yet, these requirements are needed by market segments like aeronautic, medical or transport.

Major innovations like embedded cavity filters and other microwave functions coupled with stacked copper filled microvia technology and low pitch packages (CSP, QFN with 1up to 3 rows…) will be treated.

This technological project will offer the possibility to develop a high-integrated T/R module, working at up 40GHz-45GHz frequency band. Allowing major advances in WLAN networks, Satellite communications, Point to Point networks, Mobile networks (2G, 3G, 4G) applications.

Main challenges are:

-High density PCB layout vs. electrical disturbances and parasitic coupling

-Embedded filters at high frequency on the same board (buried cavity filter or multilayer filter)

-Increased reliability by PCB warping reduction (innovative substrate solutions)

-Size and cost reducing

-New perspectives on meeting telecommunication market needs

The consortium built for this project is organised as follow:

-THALES COMMUNICATION France is leader in this project and his role is to qualify the

-SWEREA/IVF Sweden and THALES CORPORATE SERVICES France are involved in testing reliability and analysing root causes of failure on technology.

-PANASONIC Austria is involved in substrate material supplying.

-ATR&DS Austria is involved in the project as PCB maker.

-GTID PROTECNO, France is involved in the project as PCB maker.

-FLEXTRONICS Sweden is involved in the project as components assembler and reparation process optimizer.

-LABSTICC France acts as filter designer.

The duration of the project is 3 years.