Full project name: Mixed Microwave and Digital Multilayer PCB for High Density Applications
Project acronym: MIDIMU-HD
The MIDIMU-HD project aims to develop a new technology enabling the design and manufacture of high density mixed microwave circuits and digital printed circuit boards from multilayer dielectric material Key innovations include integrated filters and other microwave features coupled with stacked microvias and HDI technologies. This new approach allows a significant improvement in the long-term reliability of printed circuit boards, which is a strong demand from end-users in professional electronics. The project offers the opportunity to develop a highly integrated transceiver module operating in the target bandwidth of 40.5 to 43.5 GHz, enabling a major breakthrough for:
- WLAN networks
- Satellite communications
- Point to point and point to multipoint networks
- Mobile network (3G, 4G, 5G)
The scientific objectives of this project are to:
- Develop and validate a dielectric matching substrate material for high frequency applications, available in a wide range of laminates and prepregs to be compatible with multilayer structures.
- Design a Q-band bandpass filter (40 to 44GHZ) on an organic substrate using industrial manufacturing rules.
- Combine and integrate multilayer PCBs for high frequency applications (integration concept board, HDI, fine pitch BGA).
- Combine RF functions (including bandpass filter, power amplifier and up-converter) and HDI design on a single organic multilayer PCB.
- Validate the structure, develop assembly and repair processes, electrical testing, and reliability assessments.
- Achieve cost-effective production and testing of a transceiver (T/R) test vehicle for LTE node equipment.
For more information, please contact us