Full project name: Technologies Innovantes à Investissement Réduit et Ecologiques (Innovative, low-cost and environmentally friendly technologies)
Project acronym: TIIRECO
Nowadays, PCB manufacturers need to be skilled in mixing thick layers (microwave signals) and very high density thin layers (control signals) in the same multilayer structure. The aim of the project is to develop innovative technologies to produce these complex structures with reduced investments and limited quantities with the required reliability for applications in: Defence, Medical, Automotive, Energy.
The Tiireco project is focusing on microvias and thin traces for interconnection in order to respond to the densification and complexity of printed circuits.
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